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JXT-1000 Single Arm Wafer Transfer Robot

Product Details
JXT-1000 Single Arm Wafer Transfer Robot

INFO

The JXT-1000 series is a single arm multi joint clean atmosphere robot, mainly used for handling and conveying in processes such as wafer processing and inspection. Suitable for 2/4/6/8/12 inch wafers with high precision, stability, and cleanliness. Products can be customized according to wafer shape, size, material, and production needs.

Product Features:

  • Standard arm length for robotic arms: 100mm, 160mm, 210mm, etc. (customizable)

  • Control communication mode: Ethernet port and parallel port I/O mode

  • Motor with absolute value encoder for all axes

  • The S-curve acceleration and deceleration control method and optimization of the motion trajectory enable high-speed and high-precision handling of semiconductor wafers

  • Wafer fixation methods: vacuum adsorption, bottom support, edge clamping, Bernoulli non-contact

  • Finger materials: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials

  • Fingers can be flipped, providing optimal finger placement for the type of object being transported, equipment layout, and other requirements


SPEC

Single-arm Wafer Robot Specifications

               ModelJXT-1000 Series
               Carrying Object2/4/6/8/12 inch standard size wafer, glass substrates
               Standard arm lengthStandard robot arms: 100mm, 160mm, 210mm (Customizable)
               Holding MethodVacuum, Edge clamping, Bernoulli non-contact
               RepeatabilityRepeatability: ±0.1 mm
               Robot Model TypeCylindrical coordinate type
               Motor TypeServo Motor/Stepping Motor
               Control Axis3-axis
               Payload0.5kg

Operating Range
From the robot center to the wafer centerSubject to the mechanical drawings
Rotation Angle (Theta-axis)340 degree
Vertical Stroke (Z-axis)Subject to the mechanical drawings
               Carrying Speed(Ave.) Arm (R-axis)570 mm/sec
Rotation Angle (Theta-axis) 220 degree/sec
Vertical Stroke (Z-axis)200 mm/sec
               Carrying Speed*(Max.)Arm (R-axis)1140 mm/sec
Rotation Angle (Theta-axis) 270 degree/sec
Vertical Stroke (Z-axis)250 mm/sec
               CleanlinessISO Standard  Class1-3 (at wafer transfer level when exhausting driving part)
               UtilityPower: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more
               MassAbout 25kg


*Click to download the selection requirement table