Product Center
The JXT-2000 series is a dual arm multi joint atmospheric cleaning robot, mainly used for handling and conveying in processes such as wafer processing and inspection. Suitable for wafers of 2/4/6/8/12 inches and other sizes, it has the characteristics of high precision, high stability, and high cleanliness. Products can be customized according to wafer shape, size, material, and production needs.
Standard arm length for robotic arms: 100mm, 160mm, 210mm, etc. (customizable)
Control communication mode: Ethernet port and parallel port I/O mode
Motors with absolute encoder specifications for all axes
The S-curve acceleration and deceleration control method and optimization of the motion trajectory enable high-speed and high-precision handling of semiconductor wafers
Wafer fixation methods: vacuum adsorption, bottom support, edge clamping, Bernoulli non-contact
Finger materials: CFRP (carbon fiber), aluminum alloy, high-purity ceramics and other optional materials
Fingers can be flipped, providing optimal finger placement for the type of object being transported, equipment layout, and other requirements
Double-arm Wafer Robot Specifications | ||
| Model | JXT-2000 Series | |
| Carrying Object | 2/4/6/8/12 inch standard size wafer, glass substrates | |
| Standard arm length | Standard robot arms: 100mm, 160mm, 200mm (Customizable) | |
| Holding Method | Vacuum, Edge clamping, Bernoulli non-contact | |
| Repeatability | Within ±0.1 mm | |
| Robot Model Type | Cylindrical coordinate type | |
| Motor Type | Servo Motor/Stepping Motor | |
| Control Axis | 4-axis | |
| Payload | 0.5kg/Per arm | |
| Operating Range | From the robot center to the wafer center | Subject to the mechanical drawings |
| Rotation Angle (Theta-axis) | 340 degree | |
| Vertical Stroke (Z-axis) | Subject to the mechanical drawings | |
| Carrying Speed（Ave.） | Arm (R-axis) | 570 mm/sec |
| Rotation Angle (Theta-axis) | 220 degree/sec | |
| Vertical Stroke (Z-axis) | 200 mm/sec | |
| Carrying Speed*（Max.） | Arm (R-axis) | 1140 mm/sec |
| Rotation Angle (Theta-axis) | 270 degree/sec | |
| Vertical Stroke (Z-axis) | 250 mm/sec | |
| Cleanliness | ISO 1-3 (at wafer transfer level when exhausting driving part) | |
| Utility | Power: AC200V Single phase ±10% 2kVA; Vacuum: -53kPa or more | |
| Mass | About 30kg | |